Abstract: In this study, the effect of SiC reinforcement on the electrical, mechanical, physical properties and microstructure of copper matrix composite contact material was investigated. The composite materials were produced by using the powder metallurgy method. The unalloyed copper and SiC powder mixtures were shaped by using a uniaxial press after mixing for 10 minutes at 300 rpm. The shaped specimens were heat treated in graphite powder bad in a capped steel chamber and sintered at 800° C for 2 hours. Electrical conductivity, hardness, density measurements, microstructure analyzes and mineralogical analyzes of the samples were performed after sintering. The structure-property relationships of the produced monolithic and composite copper contact materials are discussed. It was determined that the value of electrical conductivity decreased with increasing amount of SiC phase, and hardness value increased compared to pure copper. Cu-SiC composites revealed better mechanical properties than monolithic copper contact materials.